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由工研院產科國際所身為我國指標性智庫,以兼具專業性與權威性之IEK觀點(Insightful、Enlightening、Knockout、Visionary,簡稱IEKView),為客戶創造整合性附加價值及提升產業效能,同時推動政府與產業鏈建立共識,成功複製台灣經驗向海外輸出,提升台灣產業競爭力共盡心力
 
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Advanced Semiconductor Packaging Technology and Materials are Key to the AI Era 2025/04/14
   
  The high-speed performance of advanced semiconductor chips has become the core driving force of AI technology and applications, and has contributed to the rise of generative AI. The market demand for high-speed computing power and large-scale data processing in generative AI has driven continuous advancement in high-performance computing (HPC) chips and promoted the development of advanced packaging technology. Currently, the world’s leading foundries have successfully ramped up the 3nm process and are expected to begin mass production of the 2nm process in 2025. These technological advances not only meet the demand from generative AI for high-speed computing, but also significantly improve the performance per Watt of AI chips, enabling them to support a plethora of AI use cases from content generation, smart manufacturing, and healthcare to autonomous driving. Advanced processes and packaging technologies directly related to HPC and AI will be the main drivers of the market demand. As a result, the world will become increasingly dependent on semiconductor products in the future.
 
 
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