Advanced Semiconductor Packaging Technology and Materials are Key to the AI Era
2025/04/14
The high-speed performance of advanced semiconductor chips has become the core driving force of AI technology and applications, and has contributed to the rise of generative AI. The market demand for high-speed computing power and large-scale data processing in generative AI has driven continuous advancement in high-performance computing (HPC) chips and promoted the development of advanced packaging technology.
Currently, the world’s leading foundries have successfully ramped up the 3nm process and are expected to begin mass production of the 2nm process in 2025. These technological advances not only meet the demand from generative AI for high-speed computing, but also significantly improve the performance per Watt of AI chips, enabling them to support a plethora of AI use cases from content generation, smart manufacturing, and healthcare to autonomous driving. Advanced processes and packaging technologies directly related to HPC and AI will be the main drivers of the market demand. As a result, the world will become increasingly dependent on semiconductor products in the future.
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